Managing Epoxy Tailing in Die Attach thru Design of Experiment

Die Attach Film Performance in 3D QFN Stacked Die

Consumer demand for smaller and lighter products in wiresless application with maximum functionality had drive the semiconductor industries toward the developement of 3-dimensional stacked die. One of the key technology is relies on die stacking process. A suitable bonding condition and material set are essential to achieve required reliability performance. This study is to relate the effects o...

Fluxless Die Attach by Activated Forming Gas

Eutectic god-tin (Au80Sn20) is widely used as the die-attach material for making radio-frequency (RF) and microwave devices. The metallic bonding is typically achieved by soldering using a gold-tin preform in a forming gas containing hydrogen (H2) and nitrogen (N2) to a peak temperature at 300 ̊C. The performance and reliability of the devices are strongly dependent on the quality of the die-att...

Die Attach for High Temperature Electronics Packaging

AuSi, patterned Au and off-eutectic Sn-Au-Sn die attach materials and processes have been investigated for SiC die attach for high temperature applications. AuSi shear test results after 3000 hours of aging at 325C in air showed only a slight decrease in shear strength when assembled on Mo:Mn/Pd/Au metallized AlN. However, when assembled on Mo:Mn/Ni/Au metallized AlN, the die shear strength dec...

Effect of Die Bonding Condition for Die Attach Film Performance in 3D QFN Stacked Die

Consumer demand for smaller and lighter products in wiresless application with maximum functionality had drive the semiconductor industries toward the developement of 3-dimensional stacked die. One of the key technology is relies on die stacking process. A suitable bonding condition and material set are essential to achieve required reliability performance. This study is to relate the effects o...

Thermal Characterization of Die-Attach Degradation in the Power MOSFET